DUKAROV, S.; FIJALKOWSKI, M.; PETRUSHENKO, S. .; ŠETINA, M. .; SUKHOV, V. . The relationship between adhesion and microstructure of copper films obtained in different plasma deposition modes. ФІЗИКА НИЗЬКИХ ТЕМПЕРАТУР, Харків, Україна, v. 52, n. 4, p. 536–544, 2026. Disponível em: https://fnt.ilt.kharkiv.ua/index.php/fnt/article/view/9693. Acesso em: 25 лют. 2026.